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Qualcomm Joins with SEMATECH to Advance CMOS Scaling Technology
[June 21, 2010]

Qualcomm Joins with SEMATECH to Advance CMOS Scaling Technology


TMCnet Contributor
 
Qualcomm has reportedly entered into a collaborative agreement with SEMATECH (News - Alert) to advance complementary metal-oxide semiconductor or "CMOS" scaling and assess new technologies.



SEMATECH has expanded its programs participation to include fabless companies, as well as chipmakers and equipment and materials manufacturers, to drive industry consensus and provide cost-effective solutions.

Qualcomm (News - Alert) plans to participate in a high-level engagement to assess the feasibility of technologies that are designed to extend Moore's Law, the company said.


In a release, Dan Armbrust, president and CEO of SEMATECH, said the new collaborative effort broadens the scope of participation in SEMATECH and underscores commitment to bring all sectors of the industry together in assessing technology options, creating standards, building early infrastructure and charting overall industry direction.

The collaboration with Qualcomm is one facet of SEMATECH's strategic initiative to develop new opportunities for creative cooperation across the semiconductor ecosystem so as to address the industry's technical and business challenges and reduce the cost and risk of major technology transitions, according to company officials.

SEMATECH act as a companion to members' R&D processes and help develop aspects of technology faster and cheaper than members could on their own by reducing options to the most workable solutions.

Members avoid spending the full R&D costs of ultimately unworkable solutions and lower their learning curve for new processes. Members receive early evaluation of new materials and technologies without contamination and equipment risk in their fabs.

Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies, says, "SEMATECH's strong affiliation with chip manufacturers and suppliers, universities and research institutions around the world, coupled with its R&D capabilities and technical knowledge, offer an excellent opportunity to enhance the participation in the industry's technology agenda and help shape the industry's direction."

With SEMATECH's nanoelectronics and emerging technology partners it continues accelerating the next technology revolution. With nearly 20 years of experience in moving the industry forward, SEMATECH believes that building strategic collaborations to avoid unnecessary costs while staying close to emerging innovations is the best way to keep companies moving forward as the industry creates the next technology revolution.

Earlier in June, researchers from SEMATECH's 3D Interconnect program based at the College of Nanoscale Science and Engineering's or "CNSE" Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through a series of tool and process hardening improvements, an announcement from SEMATECH said.

The SEMATECH team has explored unique 3D metrology and failure analysis techniques to complement bonding tool development. 
 

Rajani Baburajan is a contributing editor for TMCnet. To read more of Rajani's articles, please visit her columnist page.

Edited by Patrick Barnard

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