Telit Introduces New Products for Manufacturers and Developers of M2M Solutions

By Madhubanti Rudra

TMCnet Contributor

 

Telit is a global enabler of machine-to-machine (M2M) communications, providing wireless module technology enhanced by managed and value-added services, including connectivity. Adding cellular connectivity into devices has become a vital part of many M2M (machine-to-machine) developments.

 

Under this backdrop, Telit stays committed to providing manufacturers and developers with more options in the form of modules, software and services, to help them expedite time-to-market of their M2M products.

 

To this end, Telit Wireless (News - Alert) Solutions has developed a number of new offerings designed to better enable cellular connectivity.

 

In alliance with another M2M provider, Multi-Tech (News - Alert) Systems, Telit has inspired the development of end devices that include Telit modules. Devices include items such as cellular routers and modems, the company clarified in a recent statement.

 

For some companies, embedding a cellular module into a device may not be an option. The alliance provides these companies with an external solution, incorporating Multi-Tech's DE910-DUAL EV-DO CDMA modules and Telit's HE910-D penta-band HSPA+ modules.

 

The adoption of pre-certified modules can be another option for carriers, and with this in mind, Telit introduced its family of HE910 3G and 4G modules, certified by AT&T (News - Alert). These modules, featuring a low-profile and low-power consumption, are ideal for use on the carrier's HSPA and HSPA+ wireless network, the company added.

 

These modules, according to Telit, are useful for high-bandwidth mobile computing applications.

 

Telit also introduced the DE910-DUAL Mini PCIe (peripheral component interconnect express). The solution can be used to integrate wireless connectivity into connected devices such as mobile computers, MRM (mobile resource management) terminals, digital signage, and point-of-sale devices in the commercial and industrial computer markets.

 

The mini PCIe form factor has become a popular standard adopted by connected device manufacturers to integrate wireless connectivity into their devices. North America's first full-featured EV-DO mini PCIe modem supports 3.1Mbps downlink rates and 1.8Mbps uplink rates, the company said.